The Reflow Shuttle O2 measurement module represents a major leap forward in the quest for precise reflow soldering control. Oxygen (O2) measurement is crucial because it can affect the solder joint quality. It can react with the solder to form oxides, weakening the joint and making it more susceptible to failure. Additionally, O2 can cause the solder de-wetting, preventing a good bond with the PCB.
By measuring O2 levels and maintaining them below a certain threshold, manufacturers can ensure strong and reliable solder joints and reduce solder wastage. The Reflow Shuttle O2 enables manufacturers to achieve higher precision in their advanced soldering applications. The tool provides zone-by-zone analysis of oxygen levels throughout the reflow process, enabling manufacturers to precisely monitor oxygen content in parts per million (PPM) and optimise nitrogen usage.
This precise real-time control over oxygen content ensures the elimination of any prospective oxidation issues that could impact soldering quality. Even minor deviations in oxygen levels within reflow ovens can negatively affect the reflow process. Reflow Shuttle O2 allows for detection of nitrogen leaks throughout the oven zones and pinpoints oxygen fluctuations. Manufacturers can use this data to optimise nitrogen consumption and prevent issues like flux build-up.
Visitors to Productronica, taking place from 14-17 November, Munich, Germany, are invited to explore these ground-breaking solutions at Solderstar's Stand A4.246/4. Solderstar's team.