Solderstar Showcase Latest Thermal Profiling Innovations at SMTA Ohio and Michigan Expos 2025

Solderstar LLC, a global leader in thermal profiling technology for the electronics manufacturing industry, is pleased to announce its participation in two upcoming regional industry events: the SMTA Ohio Valley Expo & Tech Forum on August 21, 2025, in Independence, OH, and the SMTA Michigan Expo & Tech Forum on September 10, 2025, in Livonia, MI.

Solderstar LLC will present its latest profiling innovations designed to support manufacturers with tighter process control, greater traceability, and improved yield. On display will be the SLX ultra-compact thermal profiler, engineered for demanding production environments, and the Reflow Shuttle O₂, which enables real-time monitoring of oxygen levels in nitrogen-assisted reflow ovens.

“These regional expos are ideal opportunities for us to connect directly with our customers,” said Mark Stansfield, President at Solderstar LLC. “Our team is looking forward to discussing process challenges and demonstrating how our solutions help streamline thermal profiling, boost reliability, and reduce rework.”

Technical staff from Solderstar will be available at both events to discuss real-world applications, troubleshoot profiling issues, and advise on optimizing oven performance.