Latest SMARTLine process monitoring from Solderstar at SMT Nuremberg 2017
Solderstar, a leading specialist in the design and development of thermal profiling equipment, will demonstrate its latest generation of thermal profiling solutions at the SMT Hybrid Packaging exhibition, held in Nuremberg, Germany 16th to 18th May 2017.
Solderstar were the first profiling company to leverage the power and flexibility of internet based technologies to streamline the capture and centralisation of real-time data from reflow soldering ovens. The SMARTLine systems provide the network link and software for streaming of live process data from the ovens on the production floor. The SMARTLine system builds upon Solderstar’s range of specialised real-time process monitoring instruments and sensors; the system has been developed from the outset to work within the Industry 4.0 / Internet of Manufacturing concept, a principle where machines are connected through intelligent networks to create a SMART factory.
Offering customer flexibility has been central to the latest stage in the development of SMARTLine. The system architecture now can either be as a stand-alone solution for high through-put scenarios, or as part of a scalable network providing the potential for process visibility across multi-national organizations. This is achieved by using a mix of both local and cloud based server technologies which takes process traceability information to the next level. Additionally, the new software system can be hosted on cloud based servers; this approach will prove a valuable asset for smaller assembly companies, with ‘big data’ capture and analysis currently considered the domain of only high-end manufacturing. This approach is common in many other applications, and will make it possible for smaller size customer’s to gain the benefits of smart manufacturing data from their lines, without the need for investment or support of local server hardware to be present on-site.
This SMARTLine oven monitoring platform has also been enhanced to support the new ‘Solderstar-API’ functionality. This application programming interface (API) allows 3rd part management systems to receive data captured by the SMARTLine system for rapid integration solutions as Industry 4.0 gains further momentum.